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BA6566F-E2
 ROHM Semiconductor 		Check for Price Yes Yes Active BIPOLAR TELEPHONE SPEECH CIRCUIT 1 125 µA OTHER R-PDSO-G18 e3/e2 Not Qualified 60 °C -35 °C 260 10 18 PLASTIC/EPOXY SOP SOP18,.3 RECTANGULAR SMALL OUTLINE YES TIN/TIN COPPER GULL WING 1.27 mm DUAL 5.4 mm 11.2 mm 1.9 mm ROHM CO LTD SOIC SOP-18 18 compliant 8542.39.00.01
BA6566F-E1
 ROHM Semiconductor 		Check for Price Yes Yes Active BIPOLAR TELEPHONE SPEECH CIRCUIT 1 125 µA OTHER R-PDSO-G18 e3/e2 Not Qualified 60 °C -35 °C 260 10 18 PLASTIC/EPOXY SOP SOP18,.3 RECTANGULAR SMALL OUTLINE YES TIN/TIN COPPER GULL WING 1.27 mm DUAL 5.4 mm 11.2 mm 1.9 mm ROHM CO LTD SOIC SOP-18 18 compliant 8542.39.00.01
BA6566F-T1
 ROHM Semiconductor 		Check for Price Yes Yes Active TELEPHONE SPEECH CIRCUIT 1 R-PDSO-G18 e3/e2 Not Qualified 260 10 18 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES TIN/TIN COPPER GULL WING 1.27 mm DUAL 5.4 mm 11.2 mm 1.9 mm ROHM CO LTD SOIC SOP-18 18 compliant 8542.39.00.01
BA6566FP-T1
 ROHM Semiconductor 		Check for Price Yes Yes Active TELEPHONE SPEECH CIRCUIT 1 R-PDSO-G24 e3/e2 Not Qualified 260 10 24 PLASTIC/EPOXY HSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH YES TIN/TIN COPPER GULL WING 800 µm DUAL 5.4 mm 13.6 mm 2.11 mm ROHM CO LTD SOIC HSOP-24 24 compliant 8542.39.00.01
BA8206F-E1
 ROHM Semiconductor 		Check for Price Yes Yes Active 24 V BIPOLAR TELEPHONE RINGER CIRCUIT 1 1.7 µA OTHER R-PDSO-G8 e3/e2 Not Qualified 70 °C -25 °C 260 10 8 PLASTIC/EPOXY LSOP SOP8,.25 RECTANGULAR SMALL OUTLINE, LOW PROFILE YES TIN/TIN COPPER GULL WING 1.27 mm DUAL 4.4 mm 5 mm 1.6 mm ROHM CO LTD SOIC LSOP, SOP8,.25 8 compliant 8542.39.00.01
PCD3332-1T
 NXP Semiconductors 		Check for Price Active TELEPHONE MULTIFUNCTION CIRCUIT SELECTABLE MAKE/BREAK RATIO 2:1 3:2 1 OTHER R-PDSO-G28 Not Qualified 70 °C -25 °C 28 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 7.5 mm 17.9 mm 2.65 mm NXP SEMICONDUCTORS SOP, unknown 8542.39.00.01
BA8206F-T1
 ROHM Semiconductor 		Check for Price Yes Yes Active TELEPHONE RINGER CIRCUIT 1 R-PDSO-G8 e3/e2 Not Qualified 260 10 8 PLASTIC/EPOXY LSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE YES TIN/TIN COPPER GULL WING 1.27 mm DUAL 4.4 mm 5 mm 1.6 mm ROHM CO LTD SOIC SOP-8 8 compliant 8542.39.00.01
PCD3332-1T-T
 NXP Semiconductors 		Check for Price Active TELEPHONE MULTIFUNCTION CIRCUIT SELECTABLE MAKE/BREAK RATIO 2:1 3:2 1 OTHER R-PDSO-G28 e4 Not Qualified 70 °C -25 °C 28 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES NICKEL PALLADIUM GOLD GULL WING 1.27 mm DUAL 7.5 mm 17.9 mm 2.65 mm NXP SEMICONDUCTORS SOIC SOP, 28 unknown 8542.39.00.01
BU8307CF-T1
 ROHM Semiconductor 		Check for Price Yes Yes Active 5 V TELEPHONE DIALER CIRCUIT SELECTABLE MAKE/BREAK RATIO 1:2 1:1.5 1 R-PDSO-G24 e3/e2 Not Qualified 260 10 24 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES TIN/TIN COPPER GULL WING 1.27 mm DUAL 5.4 mm 15 mm 1.9 mm ROHM CO LTD SOIC SOP-24 24 compliant 8542.39.00.01
BA6566FPE2
 ROHM Semiconductor 		Check for Price Yes Yes Active TELEPHONE SPEECH CKT 1 R-PDSO-G26 e3/e2 Not Qualified 260 10 26 PLASTIC/EPOXY HSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH YES TIN/TIN COPPER GULL WING 800 µm DUAL 5.4 mm 13.6 mm 2.11 mm ROHM CO LTD SOIC HSSOP, 24 unknown
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