Part Details for TD2732A-2 by Intel Corporation
Overview of TD2732A-2 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for TD2732A-2
TD2732A-2 CAD Models
TD2732A-2 Part Data Attributes
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TD2732A-2
Intel Corporation
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Datasheet
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TD2732A-2
Intel Corporation
UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | DIP | |
| Package Description | CERAMIC, DIP-24 | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| JESD-30 Code | R-CDIP-T24 | |
| Memory Density | 32768 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | HMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for TD2732A-2
This table gives cross-reference parts and alternative options found for TD2732A-2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TD2732A-2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM2732BDI | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | TD2732A-2 vs AM2732BDI |
| LD2732A | UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | TD2732A-2 vs LD2732A |
| NMC27C32BQ250 | IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | National Semiconductor Corporation | TD2732A-2 vs NMC27C32BQ250 |
| NMC27C32BQE250 | IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | National Semiconductor Corporation | TD2732A-2 vs NMC27C32BQE250 |
| M2732AF6 | 4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 | STMicroelectronics | TD2732A-2 vs M2732AF6 |
| HN482732AG-25 | 4KX8 UVPROM, 250ns, PDIP24, DIP-24 | Renesas Electronics Corporation | TD2732A-2 vs HN482732AG-25 |
| LD2732A-20 | UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | TD2732A-2 vs LD2732A-20 |
| LD2732A-2 | UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | TD2732A-2 vs LD2732A-2 |
| NMC27C32BQE250 | 4KX8 UVPROM, 250ns, CDIP24, WINDOWED, CERAMIC, DIP-24 | Texas Instruments | TD2732A-2 vs NMC27C32BQE250 |
| 8001203JX | UVPROM, 4KX8, 250ns, NMOS, 1.290 X 0.610 INCH, 0.225 INCH HEIGHT, DIP-24 | Intel Corporation | TD2732A-2 vs 8001203JX |