Datasheets
TH58NVG1S3AFT05 by: Toshiba America Electronic Components

IC 256M X 8 EEPROM 3V, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48, Programmable ROM

Part Details for TH58NVG1S3AFT05 by Toshiba America Electronic Components

Overview of TH58NVG1S3AFT05 by Toshiba America Electronic Components

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Applications Consumer Electronics Computing and Data Storage

Part Details for TH58NVG1S3AFT05

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TH58NVG1S3AFT05 Part Data Attributes:

TH58NVG1S3AFT05 Toshiba America Electronic Components
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TH58NVG1S3AFT05 Toshiba America Electronic Components IC 256M X 8 EEPROM 3V, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48, Programmable ROM
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Part Package Code TSOP1
Package Description TSOP1, TSSOP48,.8,20
Pin Count 48
Reach Compliance Code unknown
ECCN Code 3A991.B.1.B.1
HTS Code 8542.32.00.51
Access Time-Max 45 ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PDSO-G48
JESD-609 Code e0
Length 18.4 mm
Memory Density 2147483648 bit
Memory IC Type EEPROM
Memory Width 8
Number of Functions 1
Number of Sectors/Size 2K
Number of Terminals 48
Number of Words 268435456 words
Number of Words Code 256000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256MX8
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Page Size 2K words
Parallel/Serial SERIAL
Programming Voltage 3 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 128K
Standby Current-Max 0.00005 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Toggle Bit NO
Type NAND TYPE
Width 12 mm

Alternate Parts for TH58NVG1S3AFT05

This table gives cross-reference parts and alternative options found for TH58NVG1S3AFT05. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TH58NVG1S3AFT05, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
NAND02GW4B2BN1E Flash, 128MX16, 25000ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 Numonyx Memory Solutions TH58NVG1S3AFT05 vs NAND02GW4B2BN1E
HY27SG162G2M-TPES Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48 SK Hynix Inc TH58NVG1S3AFT05 vs HY27SG162G2M-TPES
NAND02GW4B2BN1F Flash, 128MX16, PDSO48, 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48 Micron Technology Inc TH58NVG1S3AFT05 vs NAND02GW4B2BN1F
NAND02GR3B3AN6T Flash, 256MX8, 35ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 Numonyx Memory Solutions TH58NVG1S3AFT05 vs NAND02GR3B3AN6T
NAND02GW3B2BN1E 256MX8 FLASH 3V PROM, 25000ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 STMicroelectronics TH58NVG1S3AFT05 vs NAND02GW3B2BN1E
NAND02GR4B3CN6E Flash, 128MX16, 35ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48 Numonyx Memory Solutions TH58NVG1S3AFT05 vs NAND02GR4B3CN6E
HY27UG162G2M-SPIP Flash, 128MX16, 30ns, PDSO48, 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, USOP1-48 SK Hynix Inc TH58NVG1S3AFT05 vs HY27UG162G2M-SPIP
NAND02GR4B2BN6F Flash, 128MX16, PDSO48, 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48 Micron Technology Inc TH58NVG1S3AFT05 vs NAND02GR4B2BN6F
NAND02GW3B2CN1T Flash, 256MX8, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 Micron Technology Inc TH58NVG1S3AFT05 vs NAND02GW3B2CN1T
NAND02GR4B2AN6 Flash, 128MX16, 35ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 Numonyx Memory Solutions TH58NVG1S3AFT05 vs NAND02GR4B2AN6

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