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EFM8BB50F16G-A-SOIC16
 Silicon Laboratories Inc 		$0.6422 Yes Active YES 3.3 V SoC CMOS 5.5 V 1.8 V R-PDSO-G16 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.25 RECTANGULAR SMALL OUTLINE GULL WING 1.27 mm DUAL 1.75 mm 3.9 mm 9.9 mm SOP, SOP16,.25 Unknown 8542.31.00.01
NTA53321G0FHKZ
 NXP Semiconductors 		$0.6527 Yes Active YES 3.3 V NFC CONTROLLER CMOS OPERATES WITH -40 TO 85 FOR EEPROM WRITE OPERATION 5.5 V 1.62 V R-PQCC-N16 e4 1 105 °C -40 °C 260 30 16 PLASTIC/EPOXY VQCCN LCC16,1X.07,16 RECTANGULAR CHIP CARRIER, VERY THIN PROFILE Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) NO LEAD 400 µm QUAD 500 µm 1.8 mm 2.6 mm XQFN-16 Compliant 8542.32.00 2020-01-15
package
NT3H2211W0FTTJ
 NXP Semiconductors 		$0.6543 Yes Active YES 1.8 V NFC CONTROLLER CMOS 3.6 V 1.67 V S-PDSO-G8 e4 1 105 °C -40 °C 260 30 8 PLASTIC/EPOXY TSSOP TSSOP8,.2 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 650 µm DUAL 1.1 mm 3 mm 3 mm TSSOP, TSSOP8,.2 Compliant 8542.32.00 TSSOP 8 SOT505-1
package
MTCH6102T-I/MV
 Microchip Technology Inc 		$0.6779 Yes Active YES 3 V CAPACITIVE TOUCH SCREEN CONTROLLERS CMOS 3.6 V 1.8 V INDUSTRIAL S-PQCC-N28 e3 1 85 °C -40 °C 260 TS 16949 40 28 PLASTIC/EPOXY HVQCCN LCC28,.16SQ,16 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 400 µm QUAD 550 µm 4 mm 4 mm HVQCCN, LCC28,.16SQ,16 Compliant 8542.31.00.01 28 UQFN-28 EAR99
package
NT2H1311F0DTLH
 NXP Semiconductors 		$0.6793 Yes Active YES NFC CONTROLLER CMOS NO ASYNC, BIT 1 OTHER R-PDSO-N4 Not Qualified e4 1 70 °C -25 °C 260 30 4 PLASTIC/EPOXY HVSON SOLCC4,.08,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm DUAL 500 µm 1.5 mm 2 mm HVSON, SOLCC4,.08,20 Compliant 8542.32.00 SON 4 SOT1312-1
package
TCA8418RTWR
 Texas Instruments 		$0.6872 Yes Yes Active YES MICROPROCESSOR CIRCUIT CMOS 3.6 V 1.65 V S-PQCC-N24 e4 2 85 °C -40 °C 260 30 24 PLASTIC/EPOXY HVQCCN LCC24,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm QUAD 800 µm 4 mm 4 mm HVQCCN, LCC24,.16SQ,20 Compliant 8542.39.00.60 QFN 24 EAR99
package
TIR1000PWR
 Texas Instruments 		$0.6934 Yes Yes Active YES 3 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS CAN ALSO OPERATE AT 5V SUPPLY 3.3 V 2.7 V COMMERCIAL R-PDSO-G8 Not Qualified e4 1 70 °C 260 30 8 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 650 µm DUAL 1.2 mm 3 mm 4.4 mm Compliant 8542.39.00.60 SOIC 8 EAR99
NRF52805-CAAA-R7
 Nordic Semiconductor 		$0.6946 Not Recommended YES 3 V RFSoC CMOS 3.6 V 1.7 V R-PBGA-B28 85 °C -40 °C 28 PLASTIC/EPOXY VFBGA BGA28,6X7,16 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH BALL 400 µm BOTTOM 535 µm 2.464 mm 2.482 mm VFBGA, BGA28,6X7,16 Unknown 8542.31.00.01
ATSHA204A-RBHCZ-B
 Microchip Technology Inc 		$0.6965 Yes Active YES 3.3 V CRYPTOGRAPHIC AUTHENTICATOR CMOS 5.5 V 2 V R-XXSS-N3 e4 85 °C -40 °C TS 16949 3 UNSPECIFIED XSS RECTANGULAR SPECIAL SHAPE Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD UNSPECIFIED 550 µm 2.5 mm 6.5 mm PACAKGE-3 Compliant 8542.39.00.01 3 CONTACT-3 5A992.C
package
ATSHA204A-RBHCZ-T
 Microchip Technology Inc 		$0.6965 Yes Yes Active YES 3.3 V CRYPTOGRAPHIC AUTHENTICATOR CMOS 5.5 V 2 V R-XXSS-N3 e4 85 °C -40 °C TS 16949 3 UNSPECIFIED XSS RECTANGULAR SPECIAL SHAPE Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD UNSPECIFIED 550 µm 2.5 mm 6.5 mm XSS, Compliant 8542.39.00.01 3 CONTACT-3 5A992.C
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