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U3600BM-MFN
Atmel Corporation
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Check for Price | Obsolete | 3.6 V | BIPOLAR | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 29 mA | COMMERCIAL EXTENDED | R-PDSO-G44 | Not Qualified | 75 °C | -25 °C | 44 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 800 µm | DUAL | 7.4 mm | 17.925 mm | ATMEL CORP | SOIC | SSOP, | 44 | unknown | 8542.39.00.01 | ||||||||||||
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UPC8139GR-7JH
NEC Electronics Group
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Check for Price | No | Obsolete | 3 V | BIPOLAR | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 49 mA | COMMERCIAL EXTENDED | R-PDSO-G30 | e0 | Not Qualified | 80 °C | -30 °C | 30 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | NEC ELECTRONICS CORP | TSSOP | TSSOP, | 30 | compliant | 8542.39.00.01 | ||||||||
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ML5800SK-03
RF Micro Devices Inc
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Check for Price | Obsolete | 3.3 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 90 mA | COMMERCIAL | S-PQCC-N32 | e3 | Not Qualified | 60 °C | -10 °C | 32 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | RF MICRO DEVICES INC | QFN | HVQCCN, | 32 | unknown | 8542.39.00.01 | ||||||||||
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Z87L0116ASG
Zilog Inc
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$32.2483 | Yes | Transferred | 3.3 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | COMMERCIAL | S-PQFP-G144 | Not Qualified | 70 °C | -20 °C | NOT SPECIFIED | NOT SPECIFIED | 144 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | ZILOG INC | QFP | LFQFP, | 144 | unknown | 8542.39.00.01 | Cordless Telephone Support Circuit | ||||||||
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M64026FP
Mitsubishi Electric
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Check for Price | Transferred | CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER | 1 | R-PDSO-G16 | Not Qualified | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 5.3 mm | 10.1 mm | 2.1 mm | MITSUBISHI ELECTRIC CORP | SOIC | SOP, | 16 | unknown | 8542.39.00.01 | |||||||||||||||||
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SC14408B80VD
National Semiconductor Corporation
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Check for Price | No | Obsolete | CMOS | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | S-PQFP-G80 | e0 | Not Qualified | 80 | PLASTIC/EPOXY | QFP | QFP80,.68SQ | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 2.35 mm | NATIONAL SEMICONDUCTOR CORP | QFP, QFP80,.68SQ | unknown | 8542.39.00.01 | ||||||||||||||
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MC13110AFB
Freescale Semiconductor
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Check for Price | Transferred | 3.6 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | S-PQFP-G52 | Not Qualified | 85 °C | -40 °C | 52 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | YES | GULL WING | 650 µm | QUAD | 10 mm | 10 mm | 2.45 mm | FREESCALE SEMICONDUCTOR INC | QFP | QFP, | 52 | unknown | 8542.39.00.01 | EAR99 | ||||||||||||
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SM5130D1P
Seiko NPC Corporation
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Check for Price | No | Obsolete | 3 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 7 mA | COMMERCIAL EXTENDED | R-PDIP-T18 | Not Qualified | 80 °C | -30 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | SEIKO NPC CORP | DIP, DIP18,.3 | unknown | 8542.39.00.01 | ||||||||||||||
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TEA1118AT
NXP Semiconductors
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Check for Price | No | Obsolete | 2.9 V | BIPOLAR | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | 1.4 mA | COMMERCIAL EXTENDED | R-PDSO-G14 | e4 | Not Qualified | 75 °C | -25 °C | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 8.65 mm | 1.75 mm | NXP SEMICONDUCTORS | SOIC | SOP, SOP14,.25 | 14 | unknown | 8542.39.00.01 | |||||||
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NCL354TMX
National Semiconductor Corporation
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Check for Price | Obsolete | 3.3 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDSO-G56 | Not Qualified | 80 °C | -30 °C | 56 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | 6.1 mm | 14 mm | 1.1 mm | NATIONAL SEMICONDUCTOR CORP | TSSOP, | unknown | 8542.39.00.01 |