Filter Your Search
31 - 40 of 776 results
|
U2762B-BFSG3
Temic Semiconductors
|
Check for Price | No | Transferred | 2.9 V | BIPOLAR | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | COMMERCIAL | R-PDSO-G28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.25 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | TEMIC SEMICONDUCTORS | SSO-28 | unknown | |||||||||||||
|
HHM0130
TDK Corporation
|
Check for Price | Obsolete | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | COMMERCIAL | R-PDMW-N6 | Not Qualified | 60 °C | -10 °C | 6 | PLASTIC/EPOXY | RECTANGULAR | MICROWAVE | YES | NO LEAD | DUAL | TDK CORP | , | unknown | 8542.39.00.01 | |||||||||||||||||||
|
U3502BM-AFL
Atmel Corporation
|
Check for Price | No | Obsolete | 3.6 V | BIPOLAR | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 3.7 µA | COMMERCIAL EXTENDED | R-PDSO-G24 | e0 | Not Qualified | 75 °C | -25 °C | 24 | PLASTIC/EPOXY | SOP | SOP24,.4 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 7.4 mm | 15.425 mm | 2.6 mm | ATMEL CORP | SOP, SOP24,.4 | unknown | 8542.39.00.01 | SOIC | 24 | |||||
|
BU8241FE1
ROHM Semiconductor
|
Check for Price | Yes | Yes | Active | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 8 mA | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 15 mm | 1.9 mm | ROHM CO LTD | SOP, | compliant | 8542.39.00.01 | SOIC | 24 | |||||||
|
U2761B
Atmel Corporation
|
Check for Price | No | Obsolete | 3 V | BIPOLAR | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | OTHER | R-PDSO-G28 | e0 | Not Qualified | 85 °C | -25 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 9.055 mm | ATMEL CORP | SSOP, SSOP28,.25 | unknown | 8542.39.00.01 | SOIC | 28 | |||||||
|
S1T8527C01-Q0R0
Samsung Semiconductor
|
Check for Price | Obsolete | 3.6 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 7.5 mA | COMMERCIAL | S-PQFP-G48 | Not Qualified | 70 °C | -20 °C | 48 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | YES | GULL WING | 750 µm | QUAD | 10 mm | 10 mm | 2.3 mm | SAMSUNG SEMICONDUCTOR INC | QFP, | unknown | 8542.39.00.01 | QFP | 48 | ||||||||||
|
CXG1096FN
Sony Semiconductor
|
Check for Price | Yes | Yes | Obsolete | 3 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | OTHER | R-PDSO-N26 | e6/e4 | Not Qualified | 85 °C | -35 °C | 260 | 10 | 26 | PLASTIC/EPOXY | SON | RECTANGULAR | SMALL OUTLINE | YES | NO LEAD | DUAL | SONY CORP | SON, | unknown | 8542.39.00.01 | SOF | 26 | ||||||||||
|
KS8803BD
Samsung Semiconductor
|
Check for Price | No | Obsolete | 5 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 7 µA | COMMERCIAL EXTENDED | R-PDSO-G16 | e0 | Not Qualified | 75 °C | -30 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3.95 mm | 9.9 mm | 1.95 mm | SAMSUNG SEMICONDUCTOR INC | SOP, SOP16,.25 | compliant | 8542.39.00.01 | SOIC | 16 | |||||
|
KS8800D
Samsung Semiconductor
|
Check for Price | No | Obsolete | 4.5 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 15 mA | OTHER | R-PDSO-G18 | e0 | Not Qualified | 70 °C | -25 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.3 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | SOP, SOP18,.3 | unknown | 8542.39.00.01 | ||||||||||
|
U7006B-MLBG3
Temic Semiconductors
|
Check for Price | Transferred | 3 V | BIPOLAR | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | OTHER | R-PDSO-G16 | Not Qualified | 70 °C | -25 °C | 16 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | TEMIC SEMICONDUCTORS | PLASTIC, SSO-16 | unknown |