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Manufacturer Part Number: 71v2558s
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71V2558SA100BGGI8
 Integrated Device Technology Inc 		Check for Price Yes Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 260 µA CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC compliant 3A991.B.2.A 8542.32.00.41
IDT71V2558S166BG
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 3.5 ns 166 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 350 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41 BGA 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 119
71V2558S166BQG8
 Integrated Device Technology Inc 		Check for Price Yes Obsolete 4.7186 Mbit 18 256KX18 3.3 V 3.5 ns 166 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 350 µA CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY BGA BGA165,11X15,40 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC compliant 3A991.B.2.A 8542.32.00.41
IDT71V2558SX100PFI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 5 ns ZBT SRAM PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e0 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC compliant 3A991.B.2.A 8542.32.00.41 QFP LQFP, 100
71V2558SA133BGI8
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 4.2 ns 133 MHz ZBT SRAM COMMON 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 310 µA CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41
71V2558S200PF8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 3.2 ns 200 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 400 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES TIN LEAD GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41 TQFP LQFP, QFP100,.63X.87 100 PK100
71V2558S166BQ
 Integrated Device Technology Inc 		Check for Price No No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 3.5 ns 166 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 350 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41 BGA 13 X 15 MM, FPBGA-165 165
IDT71V2558S133BG
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 300 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41 BGA 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 119
71V2558SA100BGGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 4.7186 Mbit 18 256KX18 3.3 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 260 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC compliant 3A991.B.2.A 8542.32.00.41 BGA 22 X 14 MM, ROHS COMPLIANT, PLASTIC, MS-028AA, BGA-119 119
IDT71V2558S133BQ
 Integrated Device Technology Inc 		Check for Price No Obsolete 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 300 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41 BGA 13 X 15 MM, FBGA-165 165
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