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K4B1G1646G-BCF8T
Samsung Semiconductor
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Check for Price | Yes | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.5 V | 300 ps | 533 MHz | 8192 | DDR3 DRAM | COMMON | 4,8 | 64000000 | 67.1089 M | 3-STATE | 4,8 | 10 mA | 140 µA | CMOS | R-PBGA-B96 | Not Qualified | e3 | 1 | 260 | 96 | PLASTIC/EPOXY | FBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | MATTE TIN | BALL | 800 µm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | FBGA, BGA96,9X16,32 | compliant | EAR99 | 8542.32.00.32 | |||||||||||||||||||
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K4B1G1646E-HCK0T
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.5 V | 100 ps | 800 MHz | 8192 | DDR3 DRAM | COMMON | 4,8 | 64000000 | 67.1089 M | 3-STATE | 4,8 | CMOS | R-PBGA-B96 | Not Qualified | e1 | 3 | 260 | 96 | PLASTIC/EPOXY | FBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | unknown | EAR99 | 8542.32.00.32 | |||||||||||||||||||||||
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K4B1G1646E-HCF8T
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.5 V | 150 ps | 533 MHz | 8192 | DDR3 DRAM | COMMON | 4,8 | 64000000 | 67.1089 M | 3-STATE | 4,8 | 10 mA | 200 µA | CMOS | R-PBGA-B96 | Not Qualified | e1 | 3 | 260 | 96 | PLASTIC/EPOXY | FBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | unknown | EAR99 | 8542.32.00.32 | |||||||||||||||||||||
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K4B1G1646I-BYK00
Samsung Semiconductor
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Check for Price | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.35 V | MULTI BANK PAGE BURST | DDR DRAM | AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | YES | 1.45 V | 1.283 V | CMOS | INDUSTRIAL | R-PBGA-B96 | 85 °C | -40 °C | 96 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 13.3 mm | 7.5 mm | SAMSUNG SEMICONDUCTOR INC | VFBGA, | compliant | EAR99 | 8542.32.00.32 | ||||||||||||||||||||||
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K4B1G1646E-HCF80
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.5 V | 300 ps | 533 MHz | 8192 | MULTI BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 10 mA | 200 µA | 1.575 V | 1.425 V | CMOS | OTHER | R-PBGA-B96 | Not Qualified | e1 | 3 | 95 °C | 260 | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 13.3 mm | 7.5 mm | SAMSUNG SEMICONDUCTOR INC | TFBGA, BGA96,9X16,32 | unknown | EAR99 | 8542.32.00.32 | BGA | 96 | |||||
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K4B1G1646G-BCK0T
Samsung Semiconductor
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Check for Price | Yes | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.5 V | 225 ps | 800 MHz | 8192 | DDR3 DRAM | COMMON | 4,8 | 64000000 | 67.1089 M | 3-STATE | 4,8 | 10 mA | 195 µA | CMOS | R-PBGA-B96 | Not Qualified | e3 | 1 | 260 | 96 | PLASTIC/EPOXY | FBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | MATTE TIN | BALL | 800 µm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | FBGA, BGA96,9X16,32 | compliant | EAR99 | 8542.32.00.32 | |||||||||||||||||||
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K4B1G1646C-ZCF80
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.5 V | 300 ps | 533 MHz | 8192 | MULTI BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH | COMMON | 8 | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | YES | 8 | 1.575 V | 1.452 V | CMOS | COMMERCIAL EXTENDED | R-PBGA-B112 | Not Qualified | 85 °C | NOT SPECIFIED | NOT SPECIFIED | 112 | PLASTIC/EPOXY | TFBGA | BGA112,11X22,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 18 mm | 11 mm | SAMSUNG SEMICONDUCTOR INC | TFBGA, BGA112,11X22,32 | compliant | EAR99 | 8542.32.00.32 | BGA | 112 | |||||||||
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K4B1G1646D-HCH9
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.5 V | 255 ps | 667 MHz | 8192 | DDR3 DRAM | COMMON | 8 | 64000000 | 67.1089 M | 3-STATE | 8 | 10 mA | 350 µA | CMOS | R-PBGA-B100 | Not Qualified | e1 | 3 | 260 | 100 | PLASTIC/EPOXY | FBGA | BGA100,11X16,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | unknown | EAR99 | 8542.32.00.32 | |||||||||||||||||||||
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K4B1G1646I-BMK00
Samsung Semiconductor
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Check for Price | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.35 V | MULTI BANK PAGE BURST | DDR DRAM | AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | YES | 1.45 V | 1.283 V | CMOS | INDUSTRIAL | R-PBGA-B96 | 85 °C | -40 °C | 96 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 13.3 mm | 7.5 mm | SAMSUNG SEMICONDUCTOR INC | VFBGA, | compliant | EAR99 | 8542.32.00.32 | ||||||||||||||||||||||
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K4B1G1646I-BMMA0
Samsung Semiconductor
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Check for Price | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.35 V | MULTI BANK PAGE BURST | DDR3L DRAM | AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | YES | 1.45 V | 1.283 V | CMOS | INDUSTRIAL | R-PBGA-B96 | 85 °C | -40 °C | 96 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 13.3 mm | 7.5 mm | SAMSUNG SEMICONDUCTOR INC | VFBGA, | compliant | EAR99 | 8542.32.00.32 |