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11 - 20 of 776 results
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TA31132FN-TP1
Toshiba America Electronic Components
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Check for Price | No | No | Active | 3.5 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 5 mA | OTHER | R-PDSO-G24 | e0 | Not Qualified | 85 °C | -30 °C | 24 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 5.6 mm | 7.8 mm | 1.6 mm | TOSHIBA CORP | SSOP | LSSOP, | 24 | unknown | 8542.39.00.01 | |||||||
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BU8241FS-T1
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | SUPPORT CIRCUIT | 1 | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 2.01 mm | ROHM CO LTD | SSOP | SSOP-24 | 24 | unknown | |||||||||||
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UA31136G-P16-R
Unisonic Technologies Co Ltd
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Check for Price | Yes | Active | 2 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | OTHER | R-PDSO-G16 | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5.075 mm | 1.2 mm | UNISONIC TECHNOLOGIES CO LTD | TSSOP | HALOGEN FREE, TSSOP-16 | 16 | compliant | 8542.39.00.01 | ||||||||||
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ML5800DM
RF Micro Devices Inc
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Check for Price | Obsolete | 3.3 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 90 mA | COMMERCIAL | S-PQCC-N32 | Not Qualified | 60 °C | -10 °C | 32 | PLASTIC/EPOXY | HQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | YES | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1.05 mm | RF MICRO DEVICES INC | QFJ | HQCCN, | 32 | unknown | 8542.39.00.01 | |||||||||||
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SC14CVMDECTSF01T
Dialog Semiconductor GmbH
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Check for Price | Transferred | 1.8 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-XXMA-N88 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 88 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | UNSPECIFIED | 18 mm | 19.6 mm | 2.8 mm | DIALOG SEMICONDUCTOR GMBH | , | unknown | 8542.39.00.01 | EAR99 | ||||||||||||||
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HPMX-5002-TY1
Avago Technologies
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Check for Price | Obsolete | 3 V | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | 27 mA | S-PQFP-G48 | Not Qualified | 48 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | AVAGO TECHNOLOGIES INC | QFP | LFQFP, | 48 | unknown | 8542.39.00.01 | ||||||||||||||
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SM5132DS
Seiko NPC Corporation
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Check for Price | No | Obsolete | 5 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 6 mA | COMMERCIAL EXTENDED | R-PDSO-G16 | Not Qualified | 80 °C | -30 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | SEIKO NPC CORP | SOP, SOP16,.25 | unknown | 8542.39.00.01 | |||||||||||||
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935277007112
NXP Semiconductors
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Check for Price | Obsolete | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 8.5 mA | INDUSTRIAL | R-PDSO-G20 | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 6.5 mm | 1.5 mm | NXP SEMICONDUCTORS | LSSOP, | unknown | |||||||||||||||
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BU8242FT1
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 8 mA | R-PDSO-G20 | e3/e2 | Not Qualified | 260 | 10 | 20 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 12.5 mm | 1.9 mm | ROHM CO LTD | SOIC | SOP-20 | 20 | compliant | 8542.39.00.01 | ||||||||
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TA31102F(ER)
Toshiba America Electronic Components
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Check for Price | No | No | Active | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 6 mA | OTHER | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 1 mm | DUAL | 4.6 mm | 8.2 mm | 1.9 mm | TOSHIBA CORP | SOIC | SSOP, | 16 | unknown | 8542.39.00.01 |