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Parametric results for: Cordless Telephone ICs

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PCD5043H
 NXP Semiconductors 		Check for Price No Obsolete 3 V CMOS CORDLESS TELEPHONE BURST MODE CONTROLLER 1 12 mA OTHER R-PQFP-G64 Not Qualified 70 °C -25 °C 64 PLASTIC/EPOXY QFP QFP64,.7X.95,40 RECTANGULAR FLATPACK YES GULL WING 1 mm QUAD 14 mm 20 mm 3.2 mm NXP SEMICONDUCTORS QFP, QFP64,.7X.95,40 unknown 8542.39.00.01
AD6190ARS
 Analog Devices Inc 		Check for Price No Obsolete 3.3 V BIPOLAR CORDLESS TELEPHONE BASEBAND CIRCUIT 1 OTHER R-PDSO-G28 e0 Not Qualified 85 °C -20 °C 28 PLASTIC/EPOXY SSOP SSOP28,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 650 µm DUAL 5.3 mm 10.2 mm 2 mm ANALOG DEVICES INC SSOP-28 unknown 8542.39.00.01 SSOP 28
U2785B-MFSG3
 Temic Semiconductors 		Check for Price No Transferred 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER R-PDSO-G28 e0 Not Qualified 85 °C -25 °C 28 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING DUAL TEMIC SEMICONDUCTORS SSO-28 unknown
PCD5041HZ
 NXP Semiconductors 		Check for Price Obsolete 3 V CMOS CORDLESS TELEPHONE BURST MODE CONTROLLER 1 12 mA OTHER S-PQFP-G80 Not Qualified 70 °C -25 °C 80 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 12 mm 12 mm 1.6 mm NXP SEMICONDUCTORS LFQFP, unknown 8542.39.00.01
MC13109FB
 Motorola Mobility LLC 		Check for Price No Obsolete 2.6 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 12 mA OTHER S-PQFP-G52 e0 Not Qualified 85 °C -20 °C 52 PLASTIC/EPOXY QFP QFP52,.52SQ SQUARE FLATPACK YES TIN LEAD GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm MOTOROLA INC QFP, QFP52,.52SQ unknown 8542.39.00.01 QFP 52
HPMX-5002-STR
 Hewlett Packard Co 		Check for Price Transferred 3 V CORDLESS TELEPHONE BASEBAND CIRCUIT 1 27 mA S-PQFP-G48 Not Qualified 48 PLASTIC/EPOXY SQUARE FLATPACK YES GULL WING QUAD HEWLETT PACKARD CO , unknown 8542.39.00.01 QFP 48
TA31136FG
 Toshiba America Electronic Components 		Check for Price Active 2 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 4.6 mA OTHER R-PDSO-G16 e2 Not Qualified 85 °C -30 °C 16 PLASTIC/EPOXY SSOP SOP16,.25,40 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN SILVER GULL WING 1 mm DUAL 4.6 mm 8.2 mm 1.9 mm TOSHIBA CORP SSOP, SOP16,.25,40 unknown 8542.39.00.01 SOIC 16
BU8241F-DXE1
 ROHM Semiconductor 		Check for Price Active CORDLESS TELEPHONE SUPPORT CIRCUIT 1 R-PDSO-G24 Not Qualified 24 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 5.4 mm 15 mm 2.01 mm ROHM CO LTD SOP, compliant 8542.39.00.01 SOIC 24
935220650518
 NXP Semiconductors 		Check for Price Obsolete 2.9 V CORDLESS TELEPHONE BASEBAND CIRCUIT 1 1.4 mA COMMERCIAL EXTENDED R-PDSO-G14 Not Qualified 75 °C -25 °C 14 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 3.9 mm 8.65 mm 1.75 mm NXP SEMICONDUCTORS SOP, unknown 8542.39.00.01 SOIC 14
CT914H
 NXP Semiconductors 		Check for Price Active CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 X-XXMA-X Not Qualified UNSPECIFIED UNSPECIFIED MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED NXP SEMICONDUCTORS , unknown 8542.39.00.01
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